Prototyping services for IC Packaging

 The IC Packaging Prototyping Service is offered to all companies that meets the Small-Medium-Industries (SMI)* criteria. This is a subsidized IC package prototyping service provided by SHRDC in partnership with AIC Semiconductor (Kulim). The benefit of this program is to help companies reduce their development costs. Funding is available for educational institution. This prototyping service of IC packaging also includes backgrinding, wafer sawing and
Failure Analysis. The estimated delivery cycle is 2 to 4 weeks.

*Please visit http://www.smidec.gov.my for more information on SMI definition

Flow of IC Packaging Prototyping Service

 IC Packaging Fees

The price ranges from RM1000 – RM5000 per engineering lot, and depends on the type of assembly process or package type and the number of die.

Package Portfolio

To download CUSTOMER REQUEST FORM click HERE
Further information, please contact us at 03-55133560