IPC J-STD-001 Training and Certification Program - Requirements for Soldered Electrical and Electronic Assemblies
Get certified on the industry’s most widely used inspection standard, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies Training and Certification Program. IPC J-STD-001 has emerged as the preeminent authority for electronics assembly manufacturing worldwide. The standard describes materials, methods and verification criteria for producing high-quality soldered leaded and lead-free interconnections. It emphasizes process control and establishes industry consensus requirements for a broad range of electronic connections. This training is available in several languages.
Certified IPC Application Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections. Course fee covers: classroom and laboratory training, a written exam, skills evaluation, a copy of the standard and certification.
Choose from Two Tiers of Instruction
Certified IPC Application Specialist (CIS) training focuses on what line workers, operators, inspectors, engineers and buyers need to know to inspect or make acceptance/rejection decisions regarding bare boards. Course fee covers: classroom training and an exam, a copy of the standard and certification.
Certified IPC Trainer (CIT) training provides expanded information and materials to prepare individuals to deliver Certified IPC Application Specialist (CIS) training. Trainers and quality supervisors are excellent candidates for instructor training, as are engineering and manufacturing supervisors. Course fee covers: classroom training and an exam, certification and comprehensive materials for preparing and delivering CIS training.
TRAINING PROGRAM OUTLINE
CIT training prepares the instructor to teach all of the CIS modules. However, in CIS training only Module 1 is a required element. Other modules may be covered based on your company’s specific needs.
·General requirements such as safety, tools and electrostatic discharge (ESD)
·Wire- and terminal-assembly requirements, demonstrations and laboratory
·Through-hole technology requirements, demonstrations and laboratory
·Surface mount technology requirements, demonstrations and laboratory
·General soldered connection acceptance requirements (including lead free)
·Test methods and related standards
·Statistical process control methodology