IPC-7711/21 Training and Certification Program - Rework, Modification And Repair
Manufacturers and assemblers that want to realize dramatic cost savings by repairing and reworking electronic assemblies and printed circuit boards know the benefits of IPC-7711/7721.
This widely used standard offers a wealth of industry-approved techniques on through-hole and surface-mount rework as well as land, conductor and laminate repair.
It covers procedural requirements, tools, materials and methods for removing and replacing conformal coatings, surface mount and through-hole components. The standard also includes procedures for repairing and modifying boards and assemblies. In addition, it is now updated with additional support for lead free, BGAs and flex-print repairs.
Choose from Two Tiers of Instruction
Certified IPC Application Specialist (CIS) training focuses on what line workers, operators, inspectors, engineers and buyers need to know to inspect or make acceptance/rejection decisions regarding bare boards. Course fee covers: classroom training and an exam, a copy of the standard and certification.
Certified IPC Trainer (CIT) training provides expanded information and materials to prepare individuals to deliver Certified IPC Application Specialist (CIS) training. Trainers and quality supervisors are excellent candidates for instructor training, as are engineering and manufacturing supervisors. Course fee covers: classroom training and an exam, certification and comprehensive materials for preparing and delivering CIS training.
TRAINING PROGRAM OUTLINE
CIT training prepares the instructor to teach all of the CIS modules.
However, in CIS training only the introductory module is a required element. Other CIS-level modules are taught based on your company’s needs.
• Introduction to common rework and repair procedures
• Product classifications, skill levels, tools and materials
• Basic surface mount and through-hole component removal
• Land preparation and component installation
• Primary heating methods: conductive, convective and others
• Handling electronic assemblies
• Through-hole component removal and installation
• Chip and MELF component removal and installation
• SOIC/SOT, J-lead and QFP component removal and installation
• Wire splicing procedures
• Printed wiring board circuit and laminate repair
• Conformal coating removal