IPC-A-610 Training and Certification Program - Acceptability of Electronic Assemblies
Get certified on the industry’s most widely used inspection standard. IPC-A-610 Acceptability of Electronic Assemblies Training and Certification Program. With its comprehensive criteria for printed circuit board assemblies, IPC-A-610 is the most widely used inspection standard in the electronics industry and has earned an international reputation as the source for end-product acceptance criteria for consumer and high reliability printed circuit assemblies.
IPC-A-610 has been embraced by original equipment manufacturers and electronics manufacturing services companies worldwide. This training is available in several languages.
Certified IPC Trainer (CIT) training provides expanded information and materials to prepare individuals to deliver Certified IPC Application Specialist (CIS) training. Trainers and quality supervisors versed in electronic assembly are excellent candidates for this training, as are engineering and manufacturing supervisors who have assembly responsibilities.
Choose from Two Tiers of Instruction
Certified IPC Application Specialist (CIS) training focuses on what line workers, operators, inspectors, engineers and buyers need to know to inspect or make acceptance/rejection decisions regarding bare boards. Course fee covers: classroom training and an exam, a copy of the standard and certification.
Certified IPC Trainer (CIT) training provides expanded information and materials to prepare individuals to deliver Certified IPC Application Specialist (CIS) training. Trainers and quality supervisors are excellent candidates for instructor training, as are engineering and manufacturing supervisors. Course fee covers: classroom training and an exam, certification and comprehensive materials for preparing and delivering CIS training.
TRAINING PROGRAM OUTLINE
CIT training prepares the instructor to teach all of the CIS modules. However, in CIS training only Module 1 is a required element. Other modules may be covered based on your company’s specific needs.
• Purpose and application of IPC-A-610
• Hardware installation
• Soldering criteria, including lead-free connections
• Soldered connection requirements for connecting to terminals
• Soldered connection requirements for plated-through holes
• Surface mounting criteria for chip components, leadless and leaded chip carriers
• Swaged hardware, and heat sink requirements of mechanical assemblies
• Component mounting criteria for DIPS, socket pins and card edge connectors
• Jumper wire assembly requirements
• Solder fillet dimensional criteria for all major SMT component groups
• Soldering, such as tombstoning, dewetting, voiding and more
• Criteria for component damage, laminate conditions, cleaning and coating