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Part 1 : Introduction to HDI Technologies [2 day]

Part 2 : Next Generation HDI, Advanced Fabrication and Design [1 day]

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Title:  Next Generation Interconnect Technologies

·         Photonics (MEMS) and Embedded Waveguides in PCBs

·         Introduction To Buried Passive Technologies

·         Disruptive Technologies (Future Interconnects)

Title:  Advanced HDI Fabrication Processes

·         Laser HDI Technologies

·         Photo Dielectric Technologies

·         Other Microvia Processes -plasma, insulation displacement, etching

·         Specifying HDI, cost trends, some examples

Title : Advanced Design

·         Wiring Analysis & Density Modeling                       

·         Design Serv Mgr & HW Engineer

·         HDI Routing Strategies for BGAs

·         Large BGA Breakouts w/HDI

Title :  Buried Passives (Embedded Components)

·         Buried Passives & Very Small Discretes/SMT-Overview

·         Design & Systems Engineers

·         Buried Passives-Resistors/Capacitors Materials

·         Buried Capacitance & Electrical Performance

·         Cost, Design and Fabrication Issues

Title : Implementing HDI Technologies into your Products

·         Education / Planning / Vendor Audits                             

·         Design & Quality Engineers

·         Test Vehicle Creation and Testing  

·         Redesigning a Current Board to HDI 

·         Putting It All Together- "Next Step"