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Part 1 : Introduction to HDI Technologies [2 day]

Part 2 : Next Generation HDI, Advanced Fabrication and Design [1 day]

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High Density Interconnect (HDI) Workshop

Implementing HDI Technology – A Step By Step Approach –

Introduction & Advanced HDI – HDI Design & Using it in Products

HDI has become the most widely used emerging technology for high-performance electronics,

with fine-pitch and high I/O BGAs being a major driver. These are particular applicable to FPGA,

LGAs, and large CCGA, now common in high-performance mission-critical electronics. But

“Implementation” can be formidable!

This is a series of Workshop to relate the successful Training Program used by a number of large

Aero/Military, Telecom OEMs, Computer/ Notebook OEMs and Consumer Portable product OEMs to successfully implement HDI Technologies in their Printed Circuit Board programs. The Workshop is divided into 4-Phases, over two days that follow the implementation Program:

Introduction to HDI Fabrication Technologies

Advanced HDI Technologies and Performance

HDI Design Strategies

Using HDI In Your Products

Although an intense course, this will provide a detailed enough training to understand the

challenges and work required to be successful in HDI product implementation.

What You Will Learn

• What are the critical Printed Wiring Boards (PWBs) and Microvias (HDIs) Fabrication Technologies that are needed.
• What are the critical differences in TH versus HDI PCB design?
• Understanding the changes in PCB materials due to RoHS and HDI fabrication.
• How electrical performance can be improved with HDI strategies.
• Working with fabricators and sorting ‘hype’ from actual capabilities.
• The importance of custom test vehicles to evaluate new materials, new fabricators and new design strategies.
• How other OEMs were able to use HDI to redesign TH multi-layers with fewer layers.
• How to evaluate fabricators and potential problems to look out for.
• Prior HDI Test Vehicles and their results.

TRAINING PROGRAM OUTLINE

Day 1

Morning session: Introduction to HDI Technologies

HDI Fabrication Processes: HDI was first developed in 1982 and went into computer products

in1985. Then the rapid development of three major types of HDI, laser, plasma and photo-defined blind vias. We are now in the 3rd Generation of HDI fab processes.

IPC HDI Standards and HDI Materials: IPC Standards for Advanced Interconnects and HDI,

IPC-2315, 4104, 6016 & IPC-2226 Design standards. New generation of laser-drillable FR4

prepregs, new thin copper foils and other new vacuum-laminated films are reviewed for use in HDI boards.

HDI Quality, Fabrication Problems and Issues : Quality consideration for laser drilled vias, possible defects for HDI structures, details of the new “Super Fill” copper plating process. Statistical and DOE to provide PCB Fabricator optimizations.

Afternoon session: Advanced HDI Technologies

Controlled Impedance for HDI: Controlled impedance issues with tighter tolerances, materials effect and documentation. HDI electrical performances controlled by materials.

Electrical Performance of HDI: Basic HDI electrical performance of fine-line and blind-vias for signal loss, crosstalk, capacitance, inductance, and signal propagations

Design Rules / Structures for BGAs w/fine-pitches: Detailed HDI BGA design rules and fanout of 1.0, 0.8, 0.65, 0.5 and 0.4 mm pitches. Routing strategies of vias.

Case Studies of TH to HDI Conversions

• Case Studies / Success Stories: How to save layers and design
• HDI with the fewest layers. Three examples of High-Layers
• Through-Hole redesign to Lower-layer HDI boards

Day 2

Morning session: High Density Design Using HDI

Why Do You Need HDI In Your Designs? Fine-pitch and High-I/O BGA design rules, layer assignment, and routing. Microvia structures, how to reduce layers with Channels, creating Boulevards to increase routing density.

Design Features of High Density PWBs. Details on the new methodology to breakout big BGAs using ‘swing & rotated’ vias. Example of using these techniques on fine-pitch BGAs.

Seven (7) Most Popular HDI Stackups. The 7 popular HDI stackups w/analysis for density, costs,

signal integrity and power integrity.

New Wiring Strategies in HDI. The Need for HDI in Design, the advantages of blind-vias & HDI with drivers, the implementation barriers for HDI, metrics used in HDI and market size and growths. HDI analysis methodology.

Afternoon session: Using HDI for your Products

Electrical Performance of Signal Integrity & Power Integrity of HDI

Four types of circuit noise are reviewed and illustrated how HDI improves the SI for circuits; power supply impedance. How HDI structures can reduce or eliminate radiated EMI.

Cautions About HDI Technology and Fabricators

Industry Test Vehicles & experiences and reliability performance of HDI structures from prior OEM HDI Programs. Advanced HDI structures, 2nd and 3rd Generation including the “stacked” and “Any-Layer-Via” structures. Other ‘New Technologies’ enabled by HDI.

Vendor Capabilities and Qualification For HDI

IPC Standards for HDI Benchmarking-IPC-9151. Sample artwork and other Qualification Methods

including Process Control auditing. Example of Custom PCQRR artwork and results, including

accelerated failure testing.